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Which is the new trend of 2018 wireless charging TX? May 05, 2018

With the continuous introduction of wireless charging concepts by big brands such as Apple, Xiaomi, and Huawei, the wireless charging market will continue to prosper in 2018, and shipments of wireless chargers will continue to show good momentum. Wanshuntong found that the current complex solution of MCU + discrete components has been difficult to adapt to the market due to high costs and it is difficult to meet the market demand. Therefore, a highly integrated monolithic wireless charging transmitter IC solution can be better adapted to the market, and it is also a cost-effective solution that accessory manufacturers expect more. The small-sized and highly integrated monolithic wireless charging transmitter IC-SoC wireless charging chip scheme can be expected to be the most potential development framework to become the mainstream of wireless charging in the future.


                                 MCU Solution           SoC Solution (Ideal State)

Voltage and current detection     External               built-in

Power supply voltage regulator    External               built-in

MOS driver                        External               built-in

Receive signal demodulation       External               Built-in

The number of external components  more                  small

BOM cost                           high                  low

Q value detection                 external               built-in


From the above table, we can clearly see the overall improvement of the SoC solution compared to the MCU solution. The integrated SOC solution integrates full-bridge MOSFET drivers, voltage and current detection, signal demodulation, and buck chips. Wireless chargers require only a highly integrated SoC integration solution plus a full-bridge MOSFET and a few external components to become a complete wireless charger. There is no longer a need for a complicated solution for MCUs and peripheral components. This can achieve low cost, high reliability, and rapid development. At the same time, the integrated SoC internal MOSFET driver can be well matched to the MOSFET to achieve the best charging efficiency. Integrated SoC built-in Q-value detection, its internal FOD (metal foreign body detection). The reduction of cost and reliability increase effectively accelerate the popularity of wireless charging.


So although the SoC chip scheme is small in size, it has huge energy and a lot of functions.


Thanks to the high degree of integration of SoC solutions, external voltage regulators, op amps, and MOSFET drivers are no longer needed on the board. One chip solves all functions. The chip's peripheral circuits are simpler, and peripheral components and BOM are less. The PCB board volume will naturally become smaller. From the figure below, you can visually see a significant contrast between the SoC solution and the MCU solution in terms of volume. SoC integration solutions are significantly smaller and more sophisticated.


The wireless phone charger is one of the "EC8000 Series" of Yi Chong Wireless's fully-integrated SoC wireless charger solution. It can be seen that there is only one main control chip on this PCB. With two integrated MOS, the circuit board is very simple. The SoC solution integrates a wireless charging driver, an op amp, a main control core, and a built-in temperature protection function. All functions are implemented by one chip. Effectively reduce costs and process overhead.


Let's take a look at the wireless phone charger PCBA, control chip, driver chip based on the MCU discrete component scheme, and the op amps are all independent. The board area is obviously much larger. At the same time, the external components are much more complex than the easily integrated wireless SoC solutions. . Currently, the mainstream single-wire wireless charger on the market is a MCU+ discrete op amp and driver solution. Its components are relatively large, the PCB board is large (as shown in the figure below), and the natural cost is higher. The SCM needs special personnel to develop. At the same time, more components will also lead to the consistency of the reliability of the product. It is difficult to ensure the reliability of the product, a wide variety of preparation materials, and a complex production test process. This is not conducive to the rapid development of products, production and marketing.


Compared with traditional MCU solutions, SoC wireless charging chips have smaller size and convenient configuration, reduce the use of external components, reduce development difficulty and cost. More importantly, since the SoC solution integrates components such as signal processing and drivers, it has a high degree of integration and a small volume of energy. Rechargeable head network has reason to believe that, with rising shipments and stringent cost requirements, the highly successful integrated SoC chip on mobile power supplies will largely replace the traditional high-cost development of slower components and more MCU solutions. Occupy wireless phone charger market.